Invention Grant
- Patent Title: Light-emitting device and manufacturing method thereof
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Application No.: US15699598Application Date: 2017-09-08
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Publication No.: US10381536B2Publication Date: 2019-08-13
- Inventor: Ching-Tai Cheng , Lung-Kuan Lai , Yih-Hua Renn , Min-Hsun Hsieh
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Ditthavong & Steiner, P. C.
- Priority: TW105129262A 20160909
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/54 ; H01L25/075 ; H01L33/64

Abstract:
A light-emitting device includes a light-emitting element, a light pervious layer, an electrode defining layer, a first soldering pad and a second soldering pad. The light-emitting element has an upper surface, a bottom surface, and a lateral surface arranged between the upper surface and the bottom surface. The light pervious layer covers the upper surface and the lateral surface. The electrode defining layer covers a part of the light pervious layer. The first soldering pad and the second soldering pad are surrounded by the electrode defining layer. A gap is located between the first soldering pad and the second soldering pad while the gap remains substantially constant.
Public/Granted literature
- US20180076369A1 LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-03-15
Information query
IPC分类: