Invention Grant
- Patent Title: Flexible packaging architecture
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Application No.: US15505901Application Date: 2014-09-26
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Publication No.: US10396038B2Publication Date: 2019-08-27
- Inventor: Bok Eng Cheah , Jackson Chung Peng Kong , Shanggar Periaman , Michael Skinner , Yen Hsiang Chew , Kheng Tat Mar , Ridza Effendi Abd Razak , Kooi Chi Ooi
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2014/057648 WO 20140926
- International Announcement: WO2016/048347 WO 20160331
- Main IPC: H01L25/10
- IPC: H01L25/10 ; H01L23/538 ; H01L23/495 ; H01L25/065 ; H01L23/00 ; H01L23/373 ; H01L23/498 ; H01L21/48
Abstract:
A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.
Public/Granted literature
- US20170345763A1 FLEXIBLE PACKAGING ARCHITECTURE Public/Granted day:2017-11-30
Information query
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