A coupling system includes a first connecting unit and a second connecting unit adapted to be connected to each other either directly or indirectly through an adaptor. Each of the first connecting unit and a second connecting unit includes an enclosure with a first mating surface and a second mating face perpendicular to each other, a pair of chip modules and an electrical connector. The electrical connector is exposed on the first mating surface while the chip module is protectively hidden behind the second mating surface. The electrical connector is equipped with magnets for activating mating with a counterpart electrical connector so as to have the chip modules of the first connecting unit and those of the second connecting unit aligned for coupling.