Invention Grant
- Patent Title: System-in-package devices and methods for forming system-in-package devices
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Application No.: US15776475Application Date: 2015-12-21
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Publication No.: US10403609B2Publication Date: 2019-09-03
- Inventor: Christian Geissler , Sven Albers , Georg Seidemann , Andreas Wolter , Klaus Reingruber , Thomas Wagner , Marc Dittes
- Applicant: Intel IP Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel IP Corporation
- Current Assignee: Intel IP Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: 2SPL Patent Attorneys Part mbB
- International Application: PCT/IB2015/059829 WO 20151221
- International Announcement: WO2017/109536 WO 20170629
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L25/16 ; H01L23/48 ; H01L25/065 ; H01L25/07 ; H01L23/00 ; H01L23/498 ; H01L23/538 ; H01L21/56
Abstract:
A system-in-package device includes at least three electrical device components arranged in a common package. A first electrical device component includes a first vertical dimension, a second electrical device component includes a second vertical dimension and a third electrical device component comprises a third vertical dimension. The first electrical device component and the second electrical device component are arranged side by side in the common package. Further, the third electrical device component is arranged on top of the first electrical device component in the common package. At least a part of the third electrical device component is arranged vertically between a front side level of the second electrical device component and a back side level of the second electrical device component.
Public/Granted literature
- US20180331080A1 System-in-Package Devices and Methods for Forming System-in-Package Devices Public/Granted day:2018-11-15
Information query
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