Invention Grant
- Patent Title: MEMS microphone maximum sound pressure level extension
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Application No.: US15410298Application Date: 2017-01-19
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Publication No.: US10405105B2Publication Date: 2019-09-03
- Inventor: Mikko Kursula , Kalle I. Makinen , Roope S. Kiiski
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R1/32 ; H04R29/00

Abstract:
A micro electro-Mechanical System (MEMS) microphone includes a first back plate positioned on top of a first moving plate, wherein the first moving plate flexes in response to changes in air pressure caused by audio signals. The MEMS microphone also includes a valve comprising a valve moving plate, wherein a first end of the valve moving plate is fixedly attached to a MEMS die and the valve moving plate flexes in response to high sound pressure levels such that a second end of the valve moving plate enables airflow to prevent audio signal distortion.
Public/Granted literature
- US20180206042A1 MEMS MICROPHONE MAXIMUM SOUND PRESSURE LEVEL EXTENSION Public/Granted day:2018-07-19
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