Invention Grant
- Patent Title: Assembly and method for transfer molding
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Application No.: US15029312Application Date: 2014-10-14
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Publication No.: US10406556B2Publication Date: 2019-09-10
- Inventor: David C. Jarmon
- Applicant: UNITED TECHNOLOGIES CORPORATION
- Applicant Address: US CT Hartford
- Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Hartford
- Agency: Carlson, Gaskey & Olds, P.C.
- International Application: PCT/US2014/060400 WO 20141014
- International Announcement: WO2015/057647 WO 20150423
- Main IPC: C03B19/02
- IPC: C03B19/02 ; B05D1/00 ; B05C1/00
Abstract:
One exemplary embodiment of this disclosure relates to a transfer molding assembly including a chamber, a die within the chamber, a first gas control device configured to provide a first gas into the chamber, and a second gas control device configured to provide a second gas into the die.
Public/Granted literature
- US20160250660A1 ASSEMBLY AND METHOD FOR TRANSFER MOLDING Public/Granted day:2016-09-01
Information query
