Invention Grant
- Patent Title: Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate
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Application No.: US15634976Application Date: 2017-06-27
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Publication No.: US10410884B2Publication Date: 2019-09-10
- Inventor: Shun Mitarai , Shusaku Yanagawa , Shinji Rokuhara , Shuichi Oka
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-147551 20130716; JP2014-096477 20140508
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H05K1/11 ; H05K1/18 ; H05K3/10 ; H05K3/30 ; H05K3/46 ; H01L27/12 ; H01L23/15 ; H01L23/538 ; H01L23/373 ; H01L23/498 ; H05K3/42 ; H01L27/32 ; G02F1/1362
Abstract:
A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.
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Information query
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