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公开(公告)号：US10410884B2
公开(公告)日：2019-09-10
申请号：US15634976
申请日：2017-06-27
Applicant: Sony Corporation
Inventor： Shun Mitarai , Shusaku Yanagawa , Shinji Rokuhara , Shuichi Oka
IPC: H01L21/48 , H05K1/11 , H05K1/18 , H05K3/10 , H05K3/30 , H05K3/46 , H01L27/12 , H01L23/15 , H01L23/538 , H01L23/373 , H01L23/498 , H05K3/42 , H01L27/32 , G02F1/1362
Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.
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公开(公告)号：US09929199B2
公开(公告)日：2018-03-27
申请号：US14908319
申请日：2014-08-21
Applicant: SONY CORPORATION
Inventor： Takahiro Igarashi , Izuho Hatada , Takeshi Kodama , Kiwamu Adachi , Shuichi Oka , Shun Mitarai , Hiizu Ootorii , Shusaku Yanagawa , Katsuji Matsumoto
IPC: H01L27/146
CPC classification number: H01L27/14629 , H01L27/14663 , H01L27/14685
Abstract: There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.
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公开(公告)号：US20170301558A1
公开(公告)日：2017-10-19
申请号：US15634976
申请日：2017-06-27
Applicant: Sony Corporation
Inventor： Shun Mitarai , Shusaku Yanagawa , Shinji Rokuhara , Shuichi Oka
IPC: H01L21/48 , H01L23/373 , H01L23/498 , H01L27/12 , H01L27/32 , G02F1/1362
Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.
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公开(公告)号：US10593606B2
公开(公告)日：2020-03-17
申请号：US15574230
申请日：2016-05-11
Applicant: SONY CORPORATION
Inventor： Kousuke Seki , Yusaku Kato , Shun Mitarai , Shinji Rokuhara
IPC: B32B3/00 , H01L23/15 , H01L23/32 , H01L23/36 , H05K1/11 , H05K1/05 , H05K3/42 , H05K3/44 , H05K1/09
Abstract: The present disclosure relates to a wiring board and a manufacturing method that simultaneously solve problems of stress and heat release A wiring board as one aspect of the present disclosure includes a glass substrate as a core member, and a plurality of through holes arranged in a cyclic manner in the glass substrate. The through holes are filled with different kinds of filling materials. A wiring board manufacturing method as one aspect of the present disclosure includes: a through hole formation step of forming through holes arranged in a cyclic manner in a glass substrate serving as a core member; and a filling step of forming a protecting sheet on the glass substrate, and filling through holes with a filling material through openings formed in the protecting sheet. The present disclosure can be applied to a wiring board that has a through-electrode-equipped glass substrate as the core member.
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公开(公告)号：US09748707B2
公开(公告)日：2017-08-29
申请号：US15151772
申请日：2016-05-11
Applicant: SONY CORPORATION
Inventor： Akira Akiba , Mitsuo Hashimoto , Shinya Morita , Shun Mitarai , Mikihiro Taketomo , Kazunao Oniki , Koichi Ikeda
IPC: H01R13/6599 , H01R13/66 , H01P3/08 , H01P3/12 , H01R24/64 , H05K1/02 , H01R107/00
CPC classification number: H01R13/6691 , H01P3/08 , H01P3/085 , H01P3/121 , H01R13/6599 , H01R24/64 , H01R2107/00 , H05K1/0219 , H05K2201/0715 , H05K2201/09336 , H05K2201/09618
Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
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Patent Agency Ranking
公开(公告)号：US10763286B2
公开(公告)日：2020-09-01
申请号：US15745176
申请日：2016-07-08
Applicant: SONY CORPORATION
Inventor： Susumu Hogyoku , Shun Mitarai , Shusaku Yanagawa
Abstract: The present technology relates to a semiconductor device providing an image sensor package capable of coping with an increase in the number of I/Os of an image sensor, a manufacturing method thereof, and an electronic apparatus. The semiconductor device includes an image sensor, a glass substrate, a wiring layer, and external terminals. In the image sensor, photoelectric conversion elements are formed on a semiconductor substrate. The glass substrate is arranged on a first main surface side of the image sensor. The wiring layer is formed on a second main surface side opposite to the first main surface. Each of the external terminals outputs a signal of the image sensor. Metal wiring of the wiring layer extends to an outer peripheral portion of the image sensor and is connected to the external terminals. The present technology can be applied to, for example, an image sensor package and the like.
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公开(公告)号：US09723724B2
公开(公告)日：2017-08-01
申请号：US14327389
申请日：2014-07-09
Applicant: Sony Corporation
Inventor： Shun Mitarai , Shusaku Yanagawa , Shinji Rokuhara , Shuichi Oka
IPC: H05K1/16 , H05K3/10 , H05K1/11 , H05K1/18 , H05K3/30 , H01L27/12 , H01L23/15 , H01L21/48 , H01L23/538 , H05K3/42 , H05K3/46 , H01L27/32
CPC classification number: H01L21/486 , G02F1/136286 , H01L23/15 , H01L23/373 , H01L23/49827 , H01L23/49833 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L27/1218 , H01L27/124 , H01L27/3276 , H01L2224/16225 , H01L2224/73253 , H05K1/115 , H05K1/185 , H05K1/186 , H05K3/10 , H05K3/30 , H05K3/42 , H05K3/4605 , H05K3/4697 , Y10T29/4913 , Y10T29/49155
Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.
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公开(公告)号：US10256117B2
公开(公告)日：2019-04-09
申请号：US15568541
申请日：2016-04-25
Applicant: SONY CORPORATION
Inventor： Shun Mitarai , Shusaku Yanagawa , Hiroshi Ozaki
IPC: H01L21/02 , H01L21/48 , H01L23/498 , H05K3/42 , H01L21/683 , H05K1/03 , H05K3/46 , H01L21/288 , H01L23/00
Abstract: There is provided a method for manufacturing a wiring substrate with a through electrode, the method including providing a device substrate having a through hole, an opening of the through hole being blocked by a current supply path and the wiring substrate including the device substrate as a core layer with the through electrode; and disposing a first metal in the through hole to form the through electrode by electroplating, in a depth direction of the through hole, using the current supply path.
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9.发明申请RADIATION DETECTOR, METHOD OF MANUFACTURING RADIATION DETECTOR, IMAGING UNIT, AND IMAGING AND DISPLAY SYSTEM 有权辐射检测器，制造辐射检测器的方法，成像单元以及成像和显示系统公开(公告)号：US20160163754A1
公开(公告)日：2016-06-09
申请号：US14908319
申请日：2014-08-21
Applicant: SONY CORPORATION
Inventor： Takahiro Igarashi , Izuho Hatada , Takeshi Kodama , Kiwamu Adachi , Shuichi Oka , Shun Mitarai , Hiizu Ootoril , Shusaku Yanagawa , Katsuji Matsumoto
IPC: H01L27/146
CPC classification number: H01L27/14629 , H01L27/14663 , H01L27/14685
Abstract: There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.
Abstract translation: 提供了一种辐射检测器，包括：多个光电转换装置，每个光电转换装置至少部分地形成在嵌入层内并且具有至少部分位于嵌入层外部的光接收表面，以及多个闪烁体晶体， 所述多个闪烁器晶体中的至少第一闪烁体晶体与近端的至少一个光接收表面接触，其中所述第一闪烁体晶体在所述近端处的横截面小于所述第一闪烁体晶体的截面， 闪烁体晶体在远端。
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公开(公告)号：US09362683B2
公开(公告)日：2016-06-07
申请号：US14161914
申请日：2014-01-23
Applicant: Sony Corporation
Inventor： Akira Akiba , Mitsuo Hashimoto , Shinya Morita , Shun Mitarai , Mikihiro Taketomo , Kazunao Oniki , Koichi Ikeda
IPC: H02G15/02 , H01R13/6599 , H01P3/08 , H01P3/12 , H05K1/02
CPC classification number: H01R13/6691 , H01P3/08 , H01P3/085 , H01P3/121 , H01R13/6599 , H01R24/64 , H01R2107/00 , H05K1/0219 , H05K2201/0715 , H05K2201/09336 , H05K2201/09618
Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
Abstract translation: 信号传输电缆具有包括电介质层和金属层的电缆。 信号传输电缆还包括具有带终端的芯片的连接器。 连接器包括具有有机层的衬底，并且有机层的一部分从衬底延伸以形成电缆的电介质层。 金属层位于电介质层上，直接连接到端子。
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