Invention Grant
- Patent Title: Epitaxial substrate for semiconductor elements, semiconductor element, and manufacturing method for epitaxial substrates for semiconductor elements
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Application No.: US15965065Application Date: 2018-04-27
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Publication No.: US10418239B2Publication Date: 2019-09-17
- Inventor: Mikiya Ichimura , Sota Maehara , Yoshitaka Kuraoka
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya-shi, Aichi
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Nagoya-shi, Aichi
- Agency: Flynn Thiel, P.C.
- Priority: JP2016-005164 20160114; WOPCT/JP2016/079619 20161005
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/34 ; H01L29/778 ; H01L29/20 ; H01L29/201 ; H01L21/205 ; H01L29/40 ; H01L29/66 ; H01L29/812 ; C30B19/02 ; C30B29/40 ; H01L29/205 ; C23C16/30 ; H01L29/207

Abstract:
Provided is an epitaxial substrate for semiconductor elements which suppresses an occurrence of current collapse. The epitaxial substrate for the semiconductor elements includes: a semi-insulating free-standing substrate formed of GaN being doped with Zn; a buffer layer being adjacent to the free-standing substrate; a channel layer being adjacent to the buffer layer; and a barrier layer being provided on an opposite side of the buffer layer with the channel layer therebetween, wherein the buffer layer is a diffusion suppressing layer formed of Al-doped GaN and suppresses diffusion of Zn from the free-standing substrate into the channel layer.
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