Invention Grant
- Patent Title: Remote hydrogen plasma titanium deposition to enhance selectivity and film uniformity
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Application No.: US15802040Application Date: 2017-11-02
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Publication No.: US10418246B2Publication Date: 2019-09-17
- Inventor: Takashi Kuratomi , Avgerinos V. Gelatos , I-Cheng Chen , Faruk Gungor
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/285
- IPC: H01L21/285 ; C23C16/06 ; C23C16/455 ; C23C16/50 ; C23C16/04 ; C23C16/14 ; C23C16/452 ; H01J37/00 ; H01L21/3205 ; H01L21/67
Abstract:
Methods and apparatus to selectively deposit metal films (e.g., titanium films) are described. One of the precursors is energized to form ions and radicals of the precursor. The precursors flow through separate channels of a dual channel gas distribution assembly to react in a processing region above a substrate.
Public/Granted literature
- US20180122647A1 Remote Hydrogen Plasma Titanium Deposition to Enhance Selectivity and Film Uniformity Public/Granted day:2018-05-03
Information query
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