Invention Grant
- Patent Title: Fabrication of a vertical fin field effect transistor with a reduced contact resistance
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Application No.: US15611388Application Date: 2017-06-01
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Publication No.: US10431659B2Publication Date: 2019-10-01
- Inventor: Kangguo Cheng , Xin Miao , Wenyu Xu , Chen Zhang
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/78 ; H01L29/66 ; H01L21/8234 ; H01L21/84 ; H01L29/08 ; H01L29/10

Abstract:
A method of forming a vertical fin field effect transistor (vertical finFET) with an increased surface area between a source/drain contact and a doped region, including forming a doped region on a substrate, forming one or more interfacial features on the doped region, and forming a source/drain contact on at least a portion of the doped region, wherein the one or more interfacial features increases the surface area of the interface between the source/drain contact and the doped region compared to a flat source/drain contact-doped region interface.
Public/Granted literature
- US20170373162A1 FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH A REDUCED CONTACT RESISTANCE Public/Granted day:2017-12-28
Information query
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