Invention Grant
- Patent Title: Laminate and method of fabricating laminate
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Application No.: US15123021Application Date: 2015-02-25
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Publication No.: US10435792B2Publication Date: 2019-10-08
- Inventor: Masaru Takimoto , Yuichiro Yamauchi , Satoshi Hirano , Naoya Aikawa
- Applicant: NHK Spring Co., Ltd.
- Applicant Address: JP Yokohama-shi
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Yokohama-shi
- Agency: Locke Lord LLP
- Priority: JP2014-044190 20140306
- International Application: PCT/JP2015/055485 WO 20150225
- International Announcement: WO2015/133351 WO 20150911
- Main IPC: C23C24/04
- IPC: C23C24/04 ; B32B15/01
Abstract:
A laminate includes: a substrate; and a metallic coating that is formed from copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment, the metallic coating being deposited on the substrate.
Public/Granted literature
- US20170058406A1 LAMINATE AND METHOD OF FABRICATING LAMINATE Public/Granted day:2017-03-02
Information query
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