Invention Grant
- Patent Title: Electronic device manufacturing load port apparatus, systems, and methods
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Application No.: US15348947Application Date: 2016-11-10
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Publication No.: US10453726B2Publication Date: 2019-10-22
- Inventor: David T. Blahnik , Paul B. Reuter , Luke W. Bonecutter , Douglas B. Baumgarten
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67
Abstract:
An electronic device manufacturing system includes a factory interface that has a load port. The load port may include a panel having an opening therein and a carrier door opener that seals the opening when the door is closed. The carrier door opener may have a groove along an outer portion of the door. The groove may have a cross-sectional shape of a triangular prism frustum. A hollow O-ring may be seated in the groove and is configured to engage the panel when the carrier door opener is closed against the panel. Methods of assembling a factory interface for an electronic device manufacturing system are also provided, as are other aspects.
Public/Granted literature
- US20180130686A1 ELECTRONIC DEVICE MANUFACTURING LOAD PORT APPARATUS, SYSTEMS, AND METHODS Public/Granted day:2018-05-10
Information query
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