Invention Grant
- Patent Title: Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
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Application No.: US15600857Application Date: 2017-05-22
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Publication No.: US10461056B2Publication Date: 2019-10-29
- Inventor: Joachim Mahler , Michael Bauer , Jochen Dangelmaier , Reimund Engl , Johann Gatterbauer , Frank Hille , Michael Huettinger , Werner Kanert , Heinrich Koerner , Brigitte Ruehle , Francisco Javier Santos Rodriguez , Antonio Vellei
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Priority: DE102016109349 20160520
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/29 ; H01L21/02 ; H01L23/495
Abstract:
In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
Public/Granted literature
- US20170338169A1 CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING AN ELECTRICAL CONTACT Public/Granted day:2017-11-23
Information query
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