Invention Grant
- Patent Title: Memory channel having more than one DIMM per motherboard DIMM connector
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Application No.: US15719742Application Date: 2017-09-29
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Publication No.: US10467160B2Publication Date: 2019-11-05
- Inventor: Xiang Li , Yunhui Chu , Jun Liao , George Vergis , James A. McCall , Charles C. Phares , Konika Ganguly , Qin Li
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: G11C5/02
- IPC: G11C5/02 ; G06F13/16 ; G11C5/06 ; G06F1/18 ; H01R12/73 ; G11C5/04 ; G11C7/10
Abstract:
A method is described. The method includes receiving DDR memory channel signals from a motherboard through a larger DIMM motherboard connector. The method includes routing the signals to one of first and second smaller form factor connectors. The method includes sending the DDR memory channel signals to a DIMM that is connected to the one of the first and second smaller form factor connectors.
Public/Granted literature
- US20190102331A1 MEMORY CHANNEL HAVING MORE THAN ONE DIMM PER MOTHERBOARD DIMM CONNECTOR Public/Granted day:2019-04-04
Information query
