Invention Grant
- Patent Title: IC tag label
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Application No.: US16379428Application Date: 2019-04-09
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Publication No.: US10467519B2Publication Date: 2019-11-05
- Inventor: Keinosuke Yamaoka , Takamitsu Nakabayashi , Shosei Asaka
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2016-243727 20161215; JP2016-243728 20161215; JP2016-247771 20161221
- Main IPC: G06K19/077
- IPC: G06K19/077 ; B65D23/00 ; H01Q1/22 ; B65D55/02 ; B65D23/14 ; H01Q7/00 ; B65D25/20 ; G06K19/04

Abstract:
An IC tag label includes: an IC chip; a communication antenna element having a first end and a second end, the first end being electrically connected to the IC chip, the communication antenna element including a planar coil extending on a first surface and having a shape suitable for positioning on a bottle mouth; and a bridge wiring including a wiring element which is located in an opposed region on a second surface which is opposed to the first surface, the bridge wiring electrically connecting the second end to the IC chip. The communication antenna element has an air core section which includes a center of the planar coil, and the wiring element is a single wire including a plurality of bent sections and having a folded line shape which traverses the air core section a plurality of times in plan view perpendicular to the first surface.
Public/Granted literature
- US20190236430A1 IC TAG LABEL Public/Granted day:2019-08-01
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