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    Method for manufacturing sealing key, sealing key, and sealing device
    2.
    发明授权
    Method for manufacturing sealing key, sealing key, and sealing device 有权
    密封钥匙，密封钥匙和密封装置的制造方法

    公开(公告)号：US09443184B2

    公开(公告)日：2016-09-13

    申请号：US14858672

    申请日：2015-09-18

    Applicant: Toppan Printing Co., Ltd.

    Inventor： Keinosuke Yamaoka ,  Takamitsu Nakabayashi

    IPC: G06K19/06 ,  G06K19/077 ,  G06K19/04 ,  H01L21/52 ,  H01L21/56 ,  H01L23/053 ,  H01L23/31

    CPC classification number: G06K19/07745 ,  G06K19/048 ,  G06K19/07724 ,  G06K19/07749 ,  H01L21/52 ,  H01L21/565 ,  H01L23/053 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A sealing key includes a container and an IC tag component fixed inside the container. The container has a shape that includes a body part and an insertion part that protrudes from the body part. The IC tag component includes a base, an IC chip mounted on the base, and a circuit pattern formed on the base. The circuit pattern includes an antenna structure that is connected to the IC chip to enable the IC chip to perform non-contact communication in. A method for manufacturing the sealing key includes: arranging in a mold a support part that configures a portion of the container; arranging the IC tag component on the support part such that the circuit pattern is positioned being extended across a boundary between the insertion part and the body part; and pouring a resin into the mold to thereby form a resin seal part that configures a portion of the container and seals the IC tag component, such that the resin seal part is joined with the support part.

    Abstract translation: 密封钥匙包括固定在容器内的容器和IC标签部件。 容器具有包括主体部和从主体部突出的插入部的形状。 IC标签组件包括基座，安装在基座上的IC芯片和形成在基座上的电路图案。 电路图案包括连接到IC芯片的天线结构，以使得IC芯片能够执行非接触通信。密封键的制造方法包括：在模具中布置配置容器的一部分的支撑部分 ; 将所述IC标签部件布置在所述支撑部分上，使得所述电路图案定位在所述插入部分和所述主体部分之间的边界上延伸; 并将树脂倒入模具中，从而形成构成容器的一部分并密封IC标签部件的树脂密封部，使得树脂密封部与支撑部接合。

    Wireless IC tag and container with wireless IC tag
    3.
    发明授权
    Wireless IC tag and container with wireless IC tag 有权

    公开(公告)号：US11004321B2

    公开(公告)日：2021-05-11

    申请号：US16808116

    申请日：2020-03-03

    Applicant: TOPPAN PRINTING CO., LTD.

    Inventor： Kenji Shinohara ,  Takamitsu Nakabayashi

    IPC: G08B23/00 ,  G08B13/24 ,  G06K19/07 ,  G06K19/077 ,  B65D1/02 ,  B65D39/00

    Abstract: A container with a wireless IC tag includes a container having a container body and a sealing member for sealing an opening portion of the container body; and a wireless IC tag and a cap seal attached to the container. The container body includes a neck (extending from the opening portion. The wireless IC tag includes an antenna for contactless communication, a wiring for wire break detection, and an IC chip connected to the antenna and the wiring. The cap seal includes a cylindrical member that surrounds the neck, the cylindrical member having a metal section disposed on a side face of the neck. The wireless IC tag is disposed to extend between opposite lateral sides of the neck via the sealing member and is partially sandwiched between the neck and the cylindrical member with the IC chip exposed from the cap seal.

    Cap seal
    5.
    发明授权
    Cap seal 有权

    公开(公告)号：US10534993B2

    公开(公告)日：2020-01-14

    申请号：US16376520

    申请日：2019-04-05

    Applicant: TOPPAN PRINTING CO., LTD.

    Inventor： Kenji Shinohara ,  Takamitsu Nakabayashi ,  Keinosuke Yamaoka

    IPC: G06K19/06 ,  G06K19/077 ,  G09F3/03 ,  B65D51/24 ,  B65D41/62 ,  B65D25/20

    Abstract: A cap seal includes a cylindrical member covering a side face of the container, and a top face including an IC tag and connected to a first end that is one of two axial ends of the cylindrical member to close the cylindrical member at the first end. The cylindrical member includes a metal portion disposed on the side face of the container, and at least one insulating portion extending from the first end. The cylindrical member forms a closed annular shape in a circumferential direction of the cylindrical member, and the metal portion and the insulating portion are joined to each other.

    IC tag label
    6.
    发明授权
    IC tag label 有权

    公开(公告)号：US10467519B2

    公开(公告)日：2019-11-05

    申请号：US16379428

    申请日：2019-04-09

    Applicant: TOPPAN PRINTING CO., LTD.

    Inventor： Keinosuke Yamaoka ,  Takamitsu Nakabayashi ,  Shosei Asaka

    IPC: G06K19/077 ,  B65D23/00 ,  H01Q1/22 ,  B65D55/02 ,  B65D23/14 ,  H01Q7/00 ,  B65D25/20 ,  G06K19/04

    Abstract: An IC tag label includes: an IC chip; a communication antenna element having a first end and a second end, the first end being electrically connected to the IC chip, the communication antenna element including a planar coil extending on a first surface and having a shape suitable for positioning on a bottle mouth; and a bridge wiring including a wiring element which is located in an opposed region on a second surface which is opposed to the first surface, the bridge wiring electrically connecting the second end to the IC chip. The communication antenna element has an air core section which includes a center of the planar coil, and the wiring element is a single wire including a plurality of bent sections and having a folded line shape which traverses the air core section a plurality of times in plan view perpendicular to the first surface.

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