Invention Grant
- Patent Title: Chiplets with connection posts
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Application No.: US14822864Application Date: 2015-08-10
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Publication No.: US10468363B2Publication Date: 2019-11-05
- Inventor: Carl Prevatte , Christopher Bower , Ronald S. Cok , Matthew Meitl
- Applicant: X-Celeprint Limited
- Applicant Address: IE Cork
- Assignee: X-Celeprint Limited
- Current Assignee: X-Celeprint Limited
- Current Assignee Address: IE Cork
- Agency: Choate, Hall & Stewart LLP
- Agent William R. Haulbrook; Michael D. Schmitt
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K1/11 ; H05K3/34 ; H05K3/30

Abstract:
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
Public/Granted literature
- US20170048976A1 CHIPLETS WITH CONNECTION POSTS Public/Granted day:2017-02-16
Information query
IPC分类: