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    Micro-transfer-printable flip-chip structures and methods
    2.
    发明授权
    Micro-transfer-printable flip-chip structures and methods 有权

    公开(公告)号：US10431487B2

    公开(公告)日：2019-10-01

    申请号：US16192779

    申请日：2018-11-15

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  António José Marques Trindade ,  Ronald S. Cok ,  Brook Raymond ,  Carl Prevatte

    IPC: H01L21/683 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62 ,  H01L23/00

    Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

    Chiplets with wicking posts
    5.
    发明授权
    Chiplets with wicking posts 有权

    公开(公告)号：US10222698B2

    公开(公告)日：2019-03-05

    申请号：US15662214

    申请日：2017-07-27

    Applicant: X-Celeprint Limited

    Inventor： Carl Prevatte ,  Christopher Bower ,  Matthew Meitl

    IPC: H01L23/00 ,  G03F7/20 ,  H05K3/30

    Abstract: A printable component includes a component substrate and one or more electrical conductors. One or more electrically conductive connection posts protrudes from the component substrate to form an exposed electrical contact. Each connection post is electrically connected to at least one of the electrical conductors and one or more wicking posts protrude from the component substrate. The wicking post can be insulating. In certain embodiments, a printable component source wafer comprises a source wafer, a plurality of sacrificial portions separated by anchor portions formed in a sacrificial layer of the source wafer, and a plurality of printable components. Each printable component is disposed over a corresponding sacrificial portion and connected to an anchor portion by a tether. A destination substrate structure comprises a destination substrate having one or more electrically conductive contact pads, an adhesive layer disposed on the destination substrate, and one or more printable components.

    MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS
    8.
    发明申请
    MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS 审中-公开

    公开(公告)号：US20150371974A1

    公开(公告)日：2015-12-24

    申请号：US14743967

    申请日：2015-06-18

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

    IPC: H01L25/075 ,  H01L33/38 ,  H01L33/62

    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

    DEVICES WITH A SINGLE METAL LAYER
    9.
    发明申请
    DEVICES WITH A SINGLE METAL LAYER 审中-公开

    公开(公告)号：US20200052063A1

    公开(公告)日：2020-02-13

    申请号：US16579386

    申请日：2019-09-23

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  Carl Prevatte ,  Ronald S. Cok

    IPC: H01L27/32 ,  H01L27/146 ,  H01L27/15

    Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

    Printable inorganic semiconductor structures
    10.
    发明授权
    Printable inorganic semiconductor structures 有权

    公开(公告)号：US10522710B2

    公开(公告)日：2019-12-31

    申请号：US16502387

    申请日：2019-07-03

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

    IPC: H01L31/0256 ,  H01L33/00 ,  H01L33/32 ,  H01L33/62 ,  H01L33/44 ,  H01L33/36 ,  H01L33/38 ,  H01L29/78 ,  H01L33/26 ,  H01L33/40 ,  H01L21/683 ,  H01L33/20

    Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

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