Invention Grant
- Patent Title: Thermal-based radio selection
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Application No.: US15655723Application Date: 2017-07-20
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Publication No.: US10470074B2Publication Date: 2019-11-05
- Inventor: Rahul Kashyap , Mahesh Kommi , Kwangyoon Lee
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, L.L.P.
- Main IPC: H04W4/00
- IPC: H04W4/00 ; H04W28/02 ; H04W72/04 ; H04L12/911 ; H04W88/06 ; H04Q9/00 ; H04W72/02 ; H04W28/08

Abstract:
Various additional and alternative aspects are described herein. In some aspects, the present disclosure provides a wireless device. The wireless device includes a first radio configured to communicate with a first data network. The wireless device includes a second radio configured to communicate with a second data network. The wireless device includes a thermal sensor array configured to measure a set of one or more thermal parameters associated with the wireless device. The wireless device includes a controller configured to allocate communication of data traffic between the first radio and the second radio based on the set of one or more thermal parameters.
Public/Granted literature
- US20190028916A1 THERMAL-BASED RADIO SELECTION Public/Granted day:2019-01-24
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