Invention Grant
- Patent Title: Bendable heat plate
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Application No.: US15917539Application Date: 2018-03-09
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Publication No.: US10517192B2Publication Date: 2019-12-24
- Inventor: Wei-Chung Hsiao
- Applicant: GETAC TECHNOLOGY CORPORATION
- Applicant Address: TW Hsinchu County
- Assignee: GETAC TECHNOLOGY CORPORATION
- Current Assignee: GETAC TECHNOLOGY CORPORATION
- Current Assignee Address: TW Hsinchu County
- Priority: TW106136662A 20171025
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/04 ; F28D15/02 ; H01L23/427

Abstract:
A bendable heat plate is provided. The heat plate includes a housing, a micro-structural layer and a fluid. The housing has an inner surface and an enclosed internal space, and includes a bendable section provided with a channel maintaining structure. The micro-structural layer is formed on the inner surface of the housing. The fluid is filled in the internal space. Using the channel maintaining structure, the bendable section is provided with sufficient space for the fluid to pass through.
Public/Granted literature
- US20190124791A1 BENDABLE HEAT PLATE Public/Granted day:2019-04-25
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