Invention Grant
- Patent Title: Method for producing silicon carbide composite material
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Application No.: US15535627Application Date: 2015-12-10
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Publication No.: US10529591B2Publication Date: 2020-01-07
- Inventor: Takeshi Miyakawa , Daisuke Goto
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-256201 20141218
- International Application: PCT/JP2015/084653 WO 20151210
- International Announcement: WO2016/098681 WO 20160623
- Main IPC: C04B41/88
- IPC: C04B41/88 ; C04B35/565 ; B28B1/14 ; B28B11/24 ; B28B3/00 ; C04B35/64 ; H01L21/48 ; C04B38/06 ; H01L23/373

Abstract:
A silicon carbide composite that is lightweight and has high thermal conductivity as well as a low thermal expansion coefficient close to that of a ceramic substrate, particularly a silicon carbide composite material suitable for heat dissipating components that are required to be particularly free of warping, such as heat sinks. A method for manufacturing a silicon carbide composite obtained by impregnating a porous silicon carbide molded body with a metal having aluminum as a main component, wherein the method for manufacturing a silicon carbide composite material is characterized in that the porous silicon carbide molded article is formed by a wet molding method, and preferably the wet molding method is a wet press method or is a wet casting method.
Public/Granted literature
- US20180025919A1 METHOD FOR PRODUCING SILICON CARBIDE COMPOSITE MATERIAL Public/Granted day:2018-01-25
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