Invention Grant
- Patent Title: Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
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Application No.: US15886225Application Date: 2018-02-01
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Publication No.: US10535516B2Publication Date: 2020-01-14
- Inventor: David Kohen , Nupur Bhargava , John Tolle , Vijay D'Costa
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holdings B.V.
- Current Assignee: ASM IP Holdings B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/02 ; H01L29/165
Abstract:
A method for depositing a semiconductor structure on a surface of a substrate is disclosed. The method may include: depositing a first group IVA semiconductor layer over a surface of the substrate; contacting an exposed surface of the first group IVA semiconductor layer with a first gas comprising a first chloride gas; and depositing a second group IVA semiconductor layer over a surface of the first group IVA semiconductor layer. Related semiconductor structures are also disclosed.
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