Invention Grant
- Patent Title: Substrate structure and electronic device having coarse redistribution layer electrically connected to fine redistribution layer
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Application No.: US16188311Application Date: 2018-11-13
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Publication No.: US10535622B2Publication Date: 2020-01-14
- Inventor: Dyi-Chung Hu
- Applicant: Dyi-Chung Hu
- Agency: JCIPRNET
- Priority: TW107133917A 20180926
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/00 ; H01L27/146 ; H01L23/538 ; H01L21/48 ; H01L25/16 ; H01L23/528 ; H01L23/498

Abstract:
A substrate structure includes a first portion, a second portion, and an intermedia portion disposed between the first and the second portion and the electrically connected business. The first portion includes a first fine redistribution layer (RDL) and a first coarse RDL. The first coarse RDL includes a first coarse conductive pattern, electrically connected to the first fine conductive pattern, where a, the first coarse RDL includes a first coarse conductive pattern Layout density of the first fine conductive pattern is denser than that of the first coarse conductive pattern. The second portion includes at least one of a second fine RDL and a second coarse RDL. An electronic device including a substrate structure is also provided.
Public/Granted literature
- US20190181112A1 SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE Public/Granted day:2019-06-13
Information query
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