Invention Grant
- Patent Title: Distributed electro-static chuck cooling
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Application No.: US13863226Application Date: 2013-04-15
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Publication No.: US10537013B2Publication Date: 2020-01-14
- Inventor: Fernando Silveira , Richard Fovell , Hamid Tavassoli
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H05H1/00
- IPC: H05H1/00

Abstract:
Embodiments of the invention include an apparatus, system, and method for cooling a pedestal for supporting a workpiece during plasma processing. An embodiment of a pedestal includes: a base over which the workpiece is to be disposed, a plurality of nozzles to supply a fluid from a supply plenum to impinge on a surface of the base, and a plurality of return conduits to return the supplied fluid to a return plenum. The fluid to be supplied by the plurality of nozzles can be projected as one or more jets submerged in surrounding fluid or as a spray that emerges from a surrounding fluid within a volume between the plurality of nozzles and the base to impinge on the surface of the base.
Public/Granted literature
- US20130276981A1 DISTRIBUTED ELECTRO-STATIC CHUCK COOLING Public/Granted day:2013-10-24
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