Invention Grant
- Patent Title: Through process flow intra-chip and inter-chip electrical analysis and process control using in-line nanoprobing
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Application No.: US14751017Application Date: 2015-06-25
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Publication No.: US10539589B2Publication Date: 2020-01-21
- Inventor: Vladimir Ukraintsev , Israel Niv , Ronen Benzion
- Applicant: DCG Systems, Inc.
- Applicant Address: US CA Fremont
- Assignee: FEI EFA, Inc.
- Current Assignee: FEI EFA, Inc.
- Current Assignee Address: US CA Fremont
- Main IPC: G01Q30/02
- IPC: G01Q30/02 ; G01R31/26 ; H01J37/28 ; H01L21/66 ; G01R31/28 ; G01R1/067

Abstract:
System for performing in-line nanoprobing on semiconductor wafer. A wafer support or vertical wafer positioner is attached to a wafer stage. An SEM column, an optical microscope and a plurality of nanoprobe positioners are all attached to the ceiling. The nanoprobe positioners have one nanoprobe configured for physically contacting selected points on the wafer. A force (or touch) sensor measures contact force applied by the probe to the wafer (or the moment) when the probe physically contacts the wafer. A plurality of drift sensors are provided for calculating probe vs. wafer alignment drift in real-time during measurements.
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