Invention Grant
- Patent Title: Heat dissipation component for semiconductor element
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Application No.: US16474690Application Date: 2017-11-24
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Publication No.: US10541189B2Publication Date: 2020-01-21
- Inventor: Yosuke Ishihara , Takeshi Miyakawa , Hiroaki Ota , Hideo Tsukamoto
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2016-255584 20161228
- International Application: PCT/JP2017/042209 WO 20171124
- International Announcement: WO2018/123380 WO 20180705
- Main IPC: H01L23/373
- IPC: H01L23/373 ; C23C18/32 ; C25D7/12 ; C22C26/00

Abstract:
A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 μm and 55-195 μm, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 μm and 45-205 μm is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.
Public/Granted literature
- US20190341330A1 HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT Public/Granted day:2019-11-07
Information query
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