Invention Grant
- Patent Title: Gate cut device fabrication with extended height gates
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Application No.: US16033759Application Date: 2018-07-12
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Publication No.: US10541308B2Publication Date: 2020-01-21
- Inventor: Kangguo Cheng , Andrew M. Greene , John R. Sporre , Peng Xu
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/66 ; H01L29/06 ; H01L29/423

Abstract:
Methods of forming semiconductor devices include forming a lower dielectric layer to a height below a height of a dummy gate hardmask disposed across multiple device regions. The dummy gate structure includes a dummy gate and a dummy gate hardmask. A protective layer is formed on the dielectric layer to the height of the dummy gate hardmask. The dummy gate hardmask is etched back to expose the dummy gate.
Public/Granted literature
- US20180323272A1 GATE CUT DEVICE FABRICATION WITH EXTENDED HEIGHT GATES Public/Granted day:2018-11-08
Information query
IPC分类: