Invention Grant
- Patent Title: System and method for high-ohmic circuit
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Application No.: US15063067Application Date: 2016-03-07
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Publication No.: US10541683B2Publication Date: 2020-01-21
- Inventor: Cesare Buffa , Elmar Bach
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H03K17/687
- IPC: H03K17/687 ; G06F17/50 ; H04R19/04

Abstract:
A high-ohmic circuit includes a plurality of high-ohmic branches coupled in parallel between a first node and a second node. Each of the plurality of high-ohmic branches includes a first plurality of series connected resistive elements forming a first series path from the first node to the second node, each of the first plurality of series connected resistive elements comprising a first diode-connected transistor. Each of the plurality of high-ohmic branches further includes a second plurality of series connected resistive elements forming a second series path from the first node to the second node, each of the second plurality of series connected resistive elements comprising a second diode-connected transistor. The high-ohmic circuit further includes a plurality of switches, each of the switches being coupled between a corresponding one of the plurality of high-ohmic branches and the second node.
Public/Granted literature
- US20170257093A1 System and Method for High-Ohmic Circuit Public/Granted day:2017-09-07
Information query
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