Invention Grant
- Patent Title: Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus
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Application No.: US15448247Application Date: 2017-03-02
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Publication No.: US10553629B2Publication Date: 2020-02-04
- Inventor: Ryosuke Nakamura , Fumihiko Koga , Taiichiro Watanabe
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-104000 20130516
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G01J1/44

Abstract:
There is provided a solid-state image pickup device including: a semiconductor substrate; a photodiode formed in the semiconductor substrate; a transistor having a gate electrode part or all of which is embedded in the semiconductor substrate, the transistor being configured to read a signal electric charge from the photodiode via the gate electrode; and an electric charge transfer layer provided between the gate electrode and the photodiode.
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