Invention Grant
- Patent Title: Light-emitting dies incorporating wavelength-conversion materials and related methods
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Application No.: US16380736Application Date: 2019-04-10
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Publication No.: US10553764B2Publication Date: 2020-02-04
- Inventor: Michael A. Tischler , Alborz Amini , Thomas Pinnington , Henry Ip , Gianmarco Spiga
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L25/16 ; H01L33/00 ; H01L33/48 ; H01L33/56 ; H01L33/58 ; H01L33/60 ; H01L33/62 ; H01L33/54 ; H01L21/56
Abstract:
In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or light-detecting element) suspended in the binder and within the aperture of the frame.
Public/Granted literature
- US20190237633A1 LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS Public/Granted day:2019-08-01
Information query
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