Invention Grant
- Patent Title: Method and structure for a 3D wire block
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Application No.: US15688238Application Date: 2017-08-28
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Publication No.: US10559476B2Publication Date: 2020-02-11
- Inventor: Donald Thompson , Cosimo Cantatore
- Applicant: R&D Circuits, Inc.
- Assignee: R&D Circuits, Inc.
- Current Assignee: R&D Circuits, Inc.
- Agency: Law Office Richard B. Klar
- Agent Richard B. Klar, Esq.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01R12/52 ; H01R12/70 ; H01R13/11 ; H01R13/24
Abstract:
The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.
Public/Granted literature
- US20180068867A1 METHOD AND STRUCTURE FOR A 3D WIRE BLOCK Public/Granted day:2018-03-08
Information query
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