Invention Grant
- Patent Title: Deposition assembly and methods for depositing mold release layers on substrates
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Application No.: US15016118Application Date: 2016-02-04
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Publication No.: US10562209B2Publication Date: 2020-02-18
- Inventor: Hyun I. Kim , Rafael J. Zaldivar , James M. Helt
- Applicant: The Aerospace Corporation
- Applicant Address: US CA El Segundo
- Assignee: The Aerospace Corporation
- Current Assignee: The Aerospace Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Duane Morris LLP
- Agent Manita Rawat
- Main IPC: B05D3/10
- IPC: B05D3/10 ; B05D1/18 ; B05D5/08 ; B29C33/58 ; B29C33/62

Abstract:
A deposition assembly generally comprises a first deposition apparatus that is configured to receive a substrate, such as a glass mandrel. The first deposition apparatus is further configured to deposit a plurality of first monolayer molecules onto at least a surface of the substrate to generate a first coating structure on the substrate. A second deposition apparatus is coupled to the first deposition apparatus, and wherein the second deposition apparatus is configured to deposit a plurality of second monolayer molecules onto at least the surface of the substrate such that the second monolayer molecules are diffused through the first coating structure and at least one aperture is filled by at least one of the second monolayer molecules to generate at least one mold release layer on at least the surface of the substrate.
Public/Granted literature
- US20170225365A1 DEPOSITION ASSEMBLY AND METHODS FOR DEPOSITING MOLD RELEASE LAYERS ON SUBSTRATES Public/Granted day:2017-08-10
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