Invention Grant
- Patent Title: Heterogeneously integrated power converter assembly
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Application No.: US16055792Application Date: 2018-08-06
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Publication No.: US10566896B2Publication Date: 2020-02-18
- Inventor: Boris S. Jacobson , Steven D. Bernstein , Steven M. Lardizabal , Jason Adams , Jeffrey R. Laroche
- Applicant: RAYTHEON COMPANY
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: US MA Waltham
- Agency: Cantor Colburn LLP
- Main IPC: H02M1/44
- IPC: H02M1/44 ; H01F27/28 ; H01F27/36 ; H05K1/16 ; H02M1/42

Abstract:
A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.
Public/Granted literature
- US20190149039A1 HETEROGENEOUSLY INTEGRATED POWER CONVERTER ASSEMBLY Public/Granted day:2019-05-16
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