Invention Grant
- Patent Title: Coil substrate and method for manufacturing the same
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Application No.: US15659866Application Date: 2017-07-26
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Publication No.: US10586650B2Publication Date: 2020-03-10
- Inventor: Hirotaka Taniguchi
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-145926 20160726
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F41/04 ; H01F41/12 ; H01F17/00

Abstract:
A coil substrate includes insulating layers, and conductive layers laminated on the insulating layers in a plate thickness direction of the insulating layers, respectively. The conductive layers include three or more conductive layers and a set of conductive layers such that the set of conductive layers includes a first outermost conductive layer on one end side in the plate thickness direction and does not include a second outermost conductive layer on the opposite end side in the plate thickness direction and that the set of conductive layers includes coil portions each having a spiral form respectively and aligned in the plate thickness direction.
Public/Granted literature
- US20180033549A1 COIL SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-02-01
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