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公开(公告)号：US10903577B2
公开(公告)日：2021-01-26
申请号：US16355936
申请日：2019-03-18
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka Taniguchi
Abstract: A printed wiring board includes a laminated structure including insulating layers, and conductive layers laminated on the insulating layer, respectively, such that the conductive layers include an outermost conductive layer having a radiation slot, and an inner-side conductive layer having an excitation portion facing the radiation slot in a lamination direction. The laminated structure has a recess portion recessed from the radiation slot toward the excitation portion such that a bottom surface of the recess portion is positioned between the outermost conductive layer and the excitation portion, and the insulating layers include an insulating layer having at least a portion covering the excitation portion.
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Patent Agency Ranking
公开(公告)号：US11588089B2
公开(公告)日：2023-02-21
申请号：US16937715
申请日：2020-07-24
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka Taniguchi
Abstract: A printed wiring board includes a core substrate including core material and having opening such that the opening penetrates through the core substrate, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening of the core substrate, a first build-up layer that mounts a heat-absorbing element thereon and includes a first resin insulating layer such that the first resin insulating layer is formed on first surface of the core substrate and covering the opening of the core substrate, and a second build-up layer that mounts a heat-generating element thereon and includes a second resin insulating layer such that the formed on the second resin insulating layer is foamed on second surface of the core substrate on the opposite side and covering the opening of the core substrate and has thickness that is greater than thickness of the first resin insulating layer.
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公开(公告)号：US10586650B2
公开(公告)日：2020-03-10
申请号：US15659866
申请日：2017-07-26
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka Taniguchi
Abstract: A coil substrate includes insulating layers, and conductive layers laminated on the insulating layers in a plate thickness direction of the insulating layers, respectively. The conductive layers include three or more conductive layers and a set of conductive layers such that the set of conductive layers includes a first outermost conductive layer on one end side in the plate thickness direction and does not include a second outermost conductive layer on the opposite end side in the plate thickness direction and that the set of conductive layers includes coil portions each having a spiral form respectively and aligned in the plate thickness direction.
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公开(公告)号：US12232268B2
公开(公告)日：2025-02-18
申请号：US17680369
申请日：2022-02-25
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka Taniguchi , Akihide Ishihara
Abstract: A wiring substrate includes an insulating layer, and a build-up part formed on the insulating layer and including an interlayer insulating layer and a conductor layer. The build-up part has a cavity penetrating through the build-up part such that the cavity is formed to accommodate an electronic component and has an inner wall and a bottom surface having a groove and that the groove is extending entirely in an outer edge part of the bottom surface and formed continuously from the inner wall surface of the cavity.
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公开(公告)号：US09717151B2
公开(公告)日：2017-07-25
申请号：US14865061
申请日：2015-09-25
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka Taniguchi , Dongdong Wang , Michimasa Takahashi
CPC classification number: H05K3/4691 , H05K1/0206 , H05K1/0207 , H05K2201/0323 , H05K2201/096
Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
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公开(公告)号：US11367825B2
公开(公告)日：2022-06-21
申请号：US16937645
申请日：2020-07-24
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka Taniguchi
Abstract: A printed wiring board includes a core substrate including core material and having opening, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening, a first build-up layer including a first resin insulating layer on first surface of the core substrate and an outermost first resin insulating layer on the first resin insulating layer, and a second build-up layer including a second resin insulating layer on second surface of the core substrate and an outermost second resin insulating layer on the second resin insulating layer. The outermost first resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the first resin insulating layer and the core material, and the outermost second resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the second resin insulating layer and the core material.
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