The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.