Invention Grant
- Patent Title: High performance, thermally conductive surface mount (die attach) adhesives
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Application No.: US15746954Application Date: 2016-07-15
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Publication No.: US10590319B2Publication Date: 2020-03-17
- Inventor: Cathy Shaw Trumble , Maciej Patelka , Noriyuki Sakai , Nicholas C. Krasco
- Applicant: NAMICS CORPORATION
- Applicant Address: JP Niigata
- Assignee: NAMICS CORPORATION
- Current Assignee: NAMICS CORPORATION
- Current Assignee Address: JP Niigata
- Agency: Holtz, Holtz & Volek PC
- International Application: PCT/JP2016/003363 WO 20160715
- International Announcement: WO2017/022191 WO 20170209
- Main IPC: C09J183/04
- IPC: C09J183/04 ; C08K3/08 ; C08L83/04 ; C08L83/00 ; C09J11/04 ; C08G77/04

Abstract:
A composition including (a) 20 to 85 wt % of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt % of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt % of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane; and (iii) 0.5 to 12 wt % of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt % of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.
Public/Granted literature
- US20180251663A1 HIGH PERFORMANCE, THERMALLY CONDUCTIVE SURFACE MOUNT (DIE ATTACH) ADHESIVES Public/Granted day:2018-09-06
Information query
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