公开(公告)号：US20250154300A1

公开(公告)日：2025-05-15

申请号：US18836136

申请日：2023-02-01

Applicant: NAMICS CORPORATION

Inventor： Yu YOSHII

IPC: C08F122/14 ,  C08K7/26 ,  C08K9/06

Abstract: A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below: and a molecular weight of 230˜1,000, and (B) fumed silica having an average primary particle size of 1 nm˜50 nm and a specific surface area of 50 m2/g˜250 m2/g.

公开(公告)号：US20250026920A1

公开(公告)日：2025-01-23

申请号：US18770676

申请日：2024-07-12

Applicant: SK hynix Inc. ,  NAMICS CORPORATION

Inventor： Minsuk KIM ,  Hyunsuk LEE ,  Sungho CHO ,  Tsuyoshi KAMIMURA ,  Yosuke SAKAI ,  Makoto SUZUKI

IPC: C08K13/06 ,  C08G59/62 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L25/065

Abstract: An object of the present invention is to provide a liquid epoxy resin composition suitable for use as a mold underfill material for TSV, which composition may provide an electronic component having high wiring density, satisfactorily releasing heat generated during its driving and having high reliability. The liquid epoxy resin composition of the present invention comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C) consisting of a silica filler and an alumina filler and carbon black (D); the epoxy resin (A) comprises a specific aliphatic epoxy resin, the alumina filler has a specific particle size distribution, and the liquid epoxy resin composition gives a cured product having a thermal conductivity within a predetermined range. The liquid epoxy resin composition of the present invention gives a cured product having high thermal conductivity. Thus, in a semiconductor device that includes electronic components manufactured using the composition as a mold underfill material for TSV, deterioration of performance due to heat is suppressed. Furthermore, an electronic component manufactured using the liquid epoxy resin composition of the present invention as a mold underfill material for TSV exhibits sufficient reliability. Thus, the liquid epoxy resin composition of the present invention is highly suitable for use as a mold underfill material for TSV.

公开(公告)号：US20240145113A1

公开(公告)日：2024-05-02

申请号：US18272229

申请日：2022-01-07

Applicant: NAMICS CORPORATION

Inventor： Toshiaki OGIWARA ,  Taku FUJINO

IPC: H01B1/22 ,  H05K1/09 ,  H05K1/18

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K1/189

Abstract: A conductive composition includes conductive particles, a thermoplastic resin, and a solvent, wherein a glass transition temperature of the thermoplastic resin is 140 to 200 degrees C.

公开(公告)号：US20240047406A1

公开(公告)日：2024-02-08

申请号：US18017969

申请日：2021-06-02

Applicant: NAMICS CORPORATION

Inventor： Koji SASAKI

IPC: H01L23/00 ,  B22F1/10 ,  B22F1/054 ,  B23K35/02 ,  B23K35/30

CPC classification number: H01L24/29 ,  B22F1/10 ,  B22F1/054 ,  B23K35/025 ,  B23K35/3006 ,  H01L2224/29339 ,  H01L2224/2929 ,  B22F2301/255 ,  B22F2304/05

Abstract: Provided is a conductive composition capable of achieving excellent die shear strength by sintering silver particles together even by heat treatment at a low temperature or for a short period of time regardless of whether pressure is applied or not. The conductive composition contains silver particles (A) having an average particle size of 0.05 to 5 μm, a solvent (B), and a thermosetting resin (C). Easily saponifiable chlorine concentration of the thermosetting resin (C) is 3,000 to 12,000 ppm. The conductive composition contains 0.1 to 1.5 parts by mass of the thermosetting resin (C) based on 100 parts by mass of the silver particles (A).

公开(公告)号：US20230399550A1

公开(公告)日：2023-12-14

申请号：US18033660

申请日：2021-10-25

Applicant: NAMICS CORPORATION

Inventor： Ayako SATO

IPC: C09J11/06 ,  C09J133/10 ,  C08K5/07 ,  C08F220/18

CPC classification number: C09J11/06 ,  C09J133/10 ,  C08K5/07 ,  C08F220/1818 ,  C08F220/1812 ,  H01L27/14618

Abstract: A base-releasing composition which suppresses release of a basic compound at room temperature and rapidly releases the basic compound under predetermined conditions. The base-releasing composition includes (A) a side-chain crystalline (meth)acrylate copolymer includes (i) repeating units each derived from an ester of a C8-C32 saturated, linear primary alcohol with acrylic acid or methacrylic acid and (ii) repeating units each derived from acrylic acid or methacrylic acid, and (B) a basic compound. The amount of basic groups in the (B) basic compound is 0.01 to 1.00 mmol per 1 g of the base-releasing composition, and at least a portion of the Component (B) is included in the Component (A). A curable resin composition includes a specific 2-methylene-1,3-dicarbonyl compound in combination with the base-releasing composition.

公开(公告)号：US11817398B2

公开(公告)日：2023-11-14

申请号：US17280256

申请日：2019-09-24

Applicant: NAMICS CORPORATION

Inventor： Masashi Kajita ,  Masahiro Kitamura ,  Takayuki Higuchi ,  Noritsuka Mizumura

IPC: H01L23/00 ,  B22F1/107 ,  B22F1/054 ,  B22F1/052

CPC classification number: H01L23/562 ,  B22F1/052 ,  B22F1/054 ,  B22F1/056 ,  B22F1/107 ,  H01L24/29 ,  H01L2224/29247 ,  H01L2924/15747 ,  H01L2924/3512 ,  B22F2999/00 ,  B22F1/05 ,  B22F2304/058 ,  C22C1/0425 ,  B22F2999/00 ,  B22F2304/056 ,  B22F1/054 ,  B22F1/056 ,  B22F2304/056 ,  B22F2304/054 ,  C22C1/0425

Abstract: A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 μm to 5 μm and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.

公开(公告)号：US20230299461A1

公开(公告)日：2023-09-21

申请号：US18010265

申请日：2021-06-17

Applicant: NAMICS CORPORATION

Inventor： Hiroshi Takasugi ,  Ryo Usami ,  Fumikazu Komatsu ,  Shin Teraki

IPC: H01Q1/22 ,  H01B3/44 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01B3/442 ,  H01L23/66 ,  H01L2223/6677

Abstract: Provided is an antenna-equipped semiconductor package which is excellent in solder heat resistance and has low transmission loss. In the antenna-equipped semiconductor package 100 in which an antenna unit 5 is integrally formed in a semiconductor device unit 10, at least one of an insulating layer 1 for connecting the semiconductor device unit 10 and the antenna unit 5 and an insulating layer 1 inside the antenna unit is a cured product of a resin composition including (A) a styrene-based elastomer having a double bond and (B) a compound generating a radical.

公开(公告)号：US11674793B2

公开(公告)日：2023-06-13

申请号：US16487349

申请日：2018-02-19

Applicant: NAMICS CORPORATION

Inventor： Qinghua Wang ,  Shien Ri ,  Toshiaki Enomoto

IPC: G01B11/16 ,  G01B11/25

CPC classification number: G01B11/16 ,  G01B11/254

Abstract: A residual thermal strain distribution measurement method of measuring a residual thermal strain distribution as residual thermal deformation in a sample generated under application of a thermal load, comprises recording images of a periodic pattern present on the surface of the sample by an image recording unit at a first temperature and a sample formation temperature at which the sample is formed, generating moire fringes based on each recorded image of the periodic pattern, calculating a phase of the moire fringes for the sample at the first temperature, calculating a phase of the moire fringes for the sample at the sample formation temperature, acquiring a phase difference of the moire fringes at the sample formation temperature with respect to the first temperature, and calculating a residual thermal strain of the sample at the first temperature with respect to the sample formation temperature based on the acquired phase difference.

公开(公告)号：US20230143754A1

公开(公告)日：2023-05-11

申请号：US17912204

申请日：2021-03-15

Applicant: NAMICS CORPORATION

Inventor： Ayako SATO ,  Rieko NAGATA

IPC: C08F122/14

CPC classification number: C08F122/14

Abstract: An object of the present invention is to provide a photocurable resin composition which is quickly cured through anionic polymerization even by irradiation with ultraviolet light from a ultraviolet light-emitting diode in the UV-A or UV-B range, the resin composition suitable for the manufacture of electronic components.
The photocurable resin composition of the present invention comprises (a) a 2-methylene-1,3-dicarbonyl compound, (b) an ionic photo base generator and (c) a photo-sensitizer. The 2-methylene-1,3-dicarbonyl compound is a compound comprising at least one specific structural unit, and the ionic photo base generator is a salt comprising specific anion (i) and cation (ii).

公开(公告)号：US11634615B2

公开(公告)日：2023-04-25

申请号：US16614351

申请日：2018-05-18

Applicant: NAMICS CORPORATION

Inventor： Fuminori Arai ,  Kazuki Iwaya

IPC: C09J129/12 ,  C08K3/013 ,  C08J5/18 ,  C08K5/00 ,  C08K5/17 ,  H01L23/10 ,  C08J5/24

Abstract: A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.