Invention Grant
- Patent Title: Backside fin recess control with multi-hsi option
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Application No.: US15752241Application Date: 2015-09-25
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Publication No.: US10600810B2Publication Date: 2020-03-24
- Inventor: Aaron D. Lilak , Patrick Morrow , Stephen M. Cea , Rishabh Mehandru , Cory E. Weber
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2015/052288 WO 20150925
- International Announcement: WO2017/052604 WO 20170330
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/12 ; H01L29/78 ; H01L21/265 ; H01L29/66 ; H01L21/8234 ; H01L21/3115 ; H01L21/84 ; H01L21/306

Abstract:
Embodiments of the present invention are directed to formation of fins with different active channel heights in a tri-gate or a Fin-FET device. In an embodiment, at least two fins are formed on a front side of the substrate. A gate structure extends over a top surface and a pair of sidewalls of at least a portion of the fins. In an embodiment, the substrate is thinned to expose the bottom surface of the fins. Next, backside etching may be performed on each fin to form active channel regions. The fins may be recessed to different depths, forming active channel regions with differing heights.
Public/Granted literature
- US20190027503A1 BACKSIDE FIN RECESS CONTROL WITH MULTI-HSI OPTION Public/Granted day:2019-01-24
Information query
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