Invention Grant
- Patent Title: Scaling mobile gateways in a 3rd generation partnership project (3GPP) network
-
Application No.: US15981658Application Date: 2018-05-16
-
Publication No.: US10602349B2Publication Date: 2020-03-24
- Inventor: Jacob Alden Cooper , Karla Jean Saur , Saikrishna Edupuganti , Christian Maciocco
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H04W8/26
- IPC: H04W8/26 ; H04W40/24 ; H04W28/08 ; H04W76/11 ; H04L12/723 ; H04W88/16

Abstract:
Particular embodiments described herein provide for a system that can be configured to initialize a gateway, assign a range of tunnel endpoint identifiers (TEID) to the gateway, where the range of TEIDs are associated with the gateway, and communicate the range of TEIDs to routers, where each TEID in the range of TEIDs is used to by the router to route packets to the gateway. In an example, the range of TEIDS associated with the gateway are assigned to the gateway when the gateway was initialized and the gateway assigns the TEID for the session.
Public/Granted literature
- US20190045357A1 SCALING MOBILE GATEWAYS IN A 3RD GENERATION PARTNERSHIP PROJECT (3GPP) NETWORK Public/Granted day:2019-02-07
Information query