Invention Grant
- Patent Title: Thickened sidewall dielectric for memory cell
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Application No.: US14171656Application Date: 2014-02-03
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Publication No.: US10608005B2Publication Date: 2020-03-31
- Inventor: Ronald A. Weimer , Kyu S. Min , Thomas M. Graettinger , Durai Vishak Nirmal Ramaswamy
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L27/11568

Abstract:
Methods and devices are disclosed, such as those involving memory cell devices with improved charge retention characteristics. In one or more embodiments, a memory cell is provided having an active area defined by sidewalls of neighboring trenches. A layer of dielectric material is blanket deposited over the memory cell, and etched to form spacers on sidewalls of the active area. Dielectric material is formed over the active area, a charge trapping structure is formed over the dielectric material over the active area, and a control gate is formed over the charge trapping structure. In some embodiments, the charge trapping structure includes nanodots. In some embodiments, the width of the spacers is between about 130% and about 170% of the thickness of the dielectric material separating the charge trapping material and an upper surface of the active area.
Public/Granted literature
- US20140159136A1 THICKENED SIDEWALL DIELECTRIC FOR MEMORY CELL Public/Granted day:2014-06-12
Information query
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