Invention Grant
- Patent Title: Method for manufacturing multilayer components, and multilayer component
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Application No.: US15549427Application Date: 2016-02-11
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Publication No.: US10608161B2Publication Date: 2020-03-31
- Inventor: Marion Ottlinger , Ivan Jagust
- Applicant: EPCOS AG
- Applicant Address: DE Munich
- Assignee: EPCOS AG
- Current Assignee: EPCOS AG
- Current Assignee Address: DE Munich
- Agency: Slater Matsil, LLP
- Priority: DE102015102713 20150225
- International Application: PCT/EP2016/052927 WO 20160211
- International Announcement: WO2016/134978 WO 20160901
- Main IPC: H01L41/22
- IPC: H01L41/22 ; H01L41/083 ; H01L41/053 ; H01L41/273 ; H01L41/332 ; H01L41/338 ; H01L41/293 ; H01L41/23

Abstract:
A method for manufacturing multilayer components, and a multilayer component are disclosed. The method includes manufacturing a body comprising electrically conductive layers and dielectric layers which are stacked one above the other, wherein the body comprises at least one cavity and at least partially filling the cavity with an insulation material using capillary forces. The method further includes after partially filling the cavity, singulating the body into at least two base bodies and applying a passivation layer to surfaces of the singulated base bodies, wherein the passivation layer comprises a material which is different from the insulation material.
Public/Granted literature
- US20180026174A1 Method for Manufacturing Multilayer Components, and Multilayer Component Public/Granted day:2018-01-25
Information query
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