Invention Grant
- Patent Title: Coupling systems and methods for electronic devices
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Application No.: US15864583Application Date: 2018-01-08
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Publication No.: US10653026B2Publication Date: 2020-05-12
- Inventor: Samarth Alva , Krishnakumar Varadarajan , Yogesh Channaiah , Prakash Pillai , Sagar Pawar , Aneesh Tuljapurkar , Raghavendra N
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K5/02 ; G06K7/10 ; H01F7/02

Abstract:
Illustrative examples include a system for coupling a first electronic device to a second electronic device. The first electronic device may include a housing having a first engagement surface and a first magnet array. The first engagement surface may be adapted to receive the second electronic device. The second electronic device may include a second magnet array. An actuator coupled to the first magnet array may move the first magnet array relative to the housing and the second magnetic array, to attractively couple or repulsively de-couple the second electronic device from the first electronic device.
Public/Granted literature
- US20190215975A1 COUPLING SYSTEMS AND METHODS FOR ELECTRONIC DEVICES Public/Granted day:2019-07-11
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