Invention Grant
- Patent Title: Piezoresistive sensor with spring flexures for stress isolation
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Application No.: US16599470Application Date: 2019-10-11
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Publication No.: US10656035B2Publication Date: 2020-05-19
- Inventor: Timothy Thomas Golly , David P. Potasek , Cuong Tho Huynh
- Applicant: Rosemount Aerospace Inc.
- Applicant Address: US MN Burnsville
- Assignee: Rosemount Aerospace Inc.
- Current Assignee: Rosemount Aerospace Inc.
- Current Assignee Address: US MN Burnsville
- Agency: Kinney & Lange, P.A.
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L19/14
Abstract:
A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
Public/Granted literature
- US20200041371A1 PIEZORESISTIVE SENSOR WITH SPRING FLEXURES FOR STRESS ISOLATION Public/Granted day:2020-02-06
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