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公开(公告)号：US20230160767A1
公开(公告)日：2023-05-25
申请号：US17532687
申请日：2021-11-22
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Robert Stuelke
Abstract: A pressure sensor includes a Wheatstone bridge circuit including a first resistor, a second resistor, a third resistor, and a fourth resistor having matching output characteristics. The pressure sensor further includes a first trim resistor in series with the Wheatstone bridge circuit, wherein the first trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge. The pressure sensor additionally includes a second trim resistor in parallel or a parallel loop with the Wheatstone bridge circuit, wherein the second trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge.
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公开(公告)号：US11649158B2
公开(公告)日：2023-05-16
申请号：US16517944
申请日：2019-07-22
Applicant: Rosemount Aerospace Inc.
Inventor： Dosi Dosev , David P. Potasek , Marcus Allen Childress
IPC: B81B3/00
CPC classification number: B81B3/0021 , B81B2203/019 , B81B2203/0118
Abstract: A microelectromechanical systems (MEMS) device includes a MEMS device body connected to a first mooring portion and a second mooring portion. The MEMS device body further includes a first cantilever and a second cantilever and connected by a spring. The spring is in operable communication with the first cantilever and the second cantilever.
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公开(公告)号：US20200373109A1
公开(公告)日：2020-11-26
申请号：US16418332
申请日：2019-05-21
Applicant: Rosemount Aerospace, Inc.
Inventor： David P. Potasek , Ben Ping-Tao Fok , Roger Alan Backman
Abstract: Disclosed is a thin-film micro-fuse assembly having: a substrate; an insulating layer disposed on the substrate, the insulating layer comprising silicon dioxide; a conductor disposed on the insulating layer, the conductor forming: an inlet terminal, an outlet terminal and a fuse element between the inlet terminal and the outlet terminal, the inlet terminal and the outlet terminal widthwise converging toward the fuse element, and the fuse element having a first thickness and a first width that is between 1 and 5 times the first thickness.
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公开(公告)号：US20200370981A1
公开(公告)日：2020-11-26
申请号：US16418719
申请日：2019-05-21
Applicant: Rosemount Aerospace Inc.
Inventor： Michael Robert Daup , David P. Potasek
Abstract: A micromechanical piezoresistive pressure sensor includes a diaphragm configured to mechanically deform in response to an applied load, a sensor substrate located on the diaphragm, and a number of piezoresistive resistance devices located on the sensor substrate. The piezoresistive resistance devices are arranged in a first planar array defining a grid pattern having two or more rows, each row being aligned in a first direction. The piezoresistive resistance devices are configured to be electrically connected in a number of bridge circuits, whereby the piezoresistive resistance devices in each row is electrically connected in an associated bridge circuit. A method of using the micromechanical piezoresistive pressure sensor is also disclosed.
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公开(公告)号：US20190154729A1
公开(公告)日：2019-05-23
申请号：US16251421
申请日：2019-01-18
Applicant: Rosemount Aerospace Inc.
Inventor： Jim Golden , David P. Potasek , Marcus Allen Childress
Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.
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Patent Agency Ranking
公开(公告)号：US11768121B2
公开(公告)日：2023-09-26
申请号：US17532687
申请日：2021-11-22
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Robert Stuelke
Abstract: A pressure sensor includes a Wheatstone bridge circuit including a first resistor, a second resistor, a third resistor, and a fourth resistor having matching output characteristics. The pressure sensor further includes a first trim resistor in series with the Wheatstone bridge circuit, wherein the first trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge. The pressure sensor additionally includes a second trim resistor in parallel or a parallel loop with the Wheatstone bridge circuit, wherein the second trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge.
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公开(公告)号：US20220307920A1
公开(公告)日：2022-09-29
申请号：US17212692
申请日：2021-03-25
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Richard William Phillips
IPC: G01K13/024 , G01K7/16 , G01K1/02
Abstract: A temperature sensor assembly for measuring a gas temperature in a gas flow stream includes a first substrate having a first surface configured to be connected to a thermally conductive structure in a gas path, a first temperature sensor mounted to the first substrate a first distance from the first surface, and a second temperature sensor mounted to the first substrate a second distance from the first surface. The second distance is less than the first distance. The first and second temperature sensors are arranged along a temperature gradient.
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公开(公告)号：US09783411B1
公开(公告)日：2017-10-10
申请号：US15349607
申请日：2016-11-11
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Sean Houlihan
CPC classification number: B81B3/0086 , B81B2201/0264 , B81B2207/07 , B81C1/00269 , B81C2201/013 , G01L9/0073
Abstract: A configuration for a capacitive pressure sensor uses a silicon on insulator wafer to create an electrically isolated sensing node across a gap from a pressure sensing wafer. The electrical isolation, small area of the gap, and silicon material throughout the capacitive pressure sensor allow for minimal parasitic capacitance and avoid problems associated with thermal mismatch.
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公开(公告)号：US20170203954A1
公开(公告)日：2017-07-20
申请号：US15001067
申请日：2016-01-19
Applicant: Rosemount Aerospace Inc.
Inventor： Weibin Zhang , David P. Potasek
CPC classification number: B81B3/0021 , B81B2203/0127 , B81C1/00158 , B81C2201/0132 , B81C2201/0133 , G01L9/0048 , G01L19/0618
Abstract: A method for producing a silicon based MEMS pressure sensor includes forming a cavity in a first (100) surface of a silicon wafer with first and second parallel (100) surfaces wherein the angle between the walls of the first cavity and the first (100) surface where they intersect the first (100) surface are greater than 90 degrees and the remaining material between the bottom of the cavity and the second parallel (100) surface comprises a flexible diaphragm. The method also includes forming a backing wafer, having a through hole, and bonding the silicon wafer to the backing wafer such that the hole in the backing wafer matches up with the cavity in the second side of the (100) silicon wafer. A dielectric layer is formed on the second side of the (100) silicon wafer and a sensing element is formed on the dielectric layer to detect pressure induced deflection of the silicon diaphragm.
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公开(公告)号：US20160340176A1
公开(公告)日：2016-11-24
申请号：US14716515
申请日：2015-05-19
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Robert Stuelke
IPC: B81B7/00
CPC classification number: B81B7/0058 , B81B7/0048 , B81B2207/015 , H01L2224/48247
Abstract: A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface.
Abstract translation: 传感器封装包括歧管和MEMS管芯。 歧管包括圆柱体，凸缘和安装表面。 圆柱形主体限定第一通道，该第一通道沿着中心轴线从第一外端纵向延伸到圆柱形主体的内端。 凸缘从圆柱体延伸并且具有被配置为支撑印刷电路板的外周边。 安装表面设置在第一通道的内端。 安装表面的表面积小于被配置为与安装表面配合的MEMS管芯的表面积。
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