Invention Grant
- Patent Title: Reducing chiplet wakeup latency
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Application No.: US15907719Application Date: 2018-02-28
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Publication No.: US10656696B1Publication Date: 2020-05-19
- Inventor: Benjamin Tsien , Michael J. Tresidder , Ivan Yanfeng Wang , Kevin M. Lepak , Ann Ling , Richard M. Born , John P. Petry , Bryan P. Broussard , Eric Christopher Morton
- Applicant: Advanced Micro Devices, Inc. , ATI Technologies ULC
- Applicant Address: US CA Santa Clara CA Markham
- Assignee: Advanced Micro Devices, Inc.,ATI Technologies ULC
- Current Assignee: Advanced Micro Devices, Inc.,ATI Technologies ULC
- Current Assignee Address: US CA Santa Clara CA Markham
- Agency: Kowert Hood Munyon Rankin and Goetzel PC
- Agent Rory D. Rankin
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F1/3206 ; G06F1/3287 ; G06F1/3234

Abstract:
Systems, apparatuses, and methods for reducing chiplet interrupt latency are disclosed. A system includes one or more processing nodes, one or more memory devices, a communication fabric coupled to the processing unit(s) and memory device(s) via link interfaces, and a power management unit. The power management unit manages the power states of the various components and the link interfaces of the system. If the power management unit detects a request to wake up a given component, and the link interface to the given component is powered down, then the power management unit sends an out-of-band signal to wake up the given component in parallel with powering up the link interface. Also, when multiple link interfaces need to be powered up, the power management unit powers up the multiple link interfaces in an order which complies with voltage regulator load-step requirements while minimizing the latency of pending operations.
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