A method of fabricating an integrated circuit includes the following steps. A first reticle is used to form a first pattern, wherein the first pattern includes a first feature and a first jog part protruding from and orthogonal to the first feature. A second reticle is used to form a second pattern, wherein the second pattern includes a second feature, and the first feature is between the second feature and the first jog part. A third reticle is used to form a third pattern, wherein the third pattern includes a third-one feature overlapping the first jog part and a third-two feature overlapping the second feature.