Invention Grant
- Patent Title: Gate cut device fabrication with extended height gates
-
Application No.: US16033786Application Date: 2018-07-12
-
Publication No.: US10658473B2Publication Date: 2020-05-19
- Inventor: Kangguo Cheng , Andrew M. Greene , John R. Sporre , Peng Xu
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/66 ; H01L29/06 ; H01L29/423 ; H01L21/8234 ; H01L29/78 ; H01L29/775

Abstract:
Semiconductor devices include a first dielectric layer formed over a source and drain region. A second dielectric layer is formed over the first dielectric layer, the second dielectric layer having a flat, non-recessed top surface. A gate stack passes vertically through the first and second dielectric layers to contact the source and drain regions and an underlying substrate.
Public/Granted literature
- US20180331194A1 GATE CUT DEVICE FABRICATION WITH EXTENDED HEIGHT GATES Public/Granted day:2018-11-15
Information query
IPC分类: