Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16182849Application Date: 2018-11-07
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Publication No.: US10665750B2Publication Date: 2020-05-26
- Inventor: Jing-Jie Dai , Tzu-Chieh Hu
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: Epistar Corporation
- Current Assignee: Epistar Corporation
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L33/14
- IPC: H01L33/14 ; H01L33/32 ; H01L33/06 ; H01L33/30 ; H01L33/00 ; H01L33/04

Abstract:
A semiconductor device includes: a first semiconductor layer; a second semiconductor layer including a first dopant of a first conductivity type and a second dopant of a second conductivity type, wherein the first dopant has a doping concentration, and the first conductivity type is different from the second conductivity type; a third semiconductor layer on the second semiconductor layer, wherein the third semiconductor layer includes a third dopant including a doping concentration higher than the doping concentration of the first dopant; and an active region between the first semiconductor layer and the second semiconductor layer; wherein the second semiconductor layer includes a bottom surface facing the active region, and the active region includes a top surface facing the second semiconductor layer, and a distance between the bottom surface of the second semiconductor layer and the top surface of the active region is not less than 2 nm.
Public/Granted literature
- US20190157511A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-05-23
Information query
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